Before Reverse Engineering Wireless Communication PCB Board, we must first determine the stacking structure of the multilayer circuit board, just like building a house, you must first have the walls of the house. The determination of the stack structure of the circuit board is related to many factors such as the complexity of the reverse engineering printed circuit board design and the consideration of electromagnetic compatibility. The figure below shows the common stacking methods of four-layer board, six-layer board and eight-layer board.
Reverse Engineering Wireless Communication PCB Board
In the PCB stack structure of the wireless network electronic pcb card, there is basically no single-sided situation, so this article will not discuss the single-sided situation. Problems that should be paid attention to in the cloning design of two-layer printed circuit boards.
In the Reverse Engineering Wireless Communication PCB Board, we generally use the second layer as a complete ground plane, and at the same time, we also put important signal lines on the top layer (including RF traces of course), so as to control the impedance well. In the design of six-layer boards or more, we also use the second layer as a complete ground plane, and then take the most important signal lines on the top layer.
PS: Polar can be used to calculate single-ended impedance and impedance, etc. Some Layout software itself integrates impedance calculators, such as Allegro.
