While improving reliability and lowering costs, printed circuit board (PCB) manufacturers are also facing major pressures such as increasing density, reducing footprint, reducing side dimensions, managing heat flow, and increasing data rates. Reverse Engineering Printed Circuit Board with multiple connectors alignment can help engineer to redesign original printed circuit board layout and make necessary improvement over it;
Reverse Engineering Printed Circuit Board with multiple connectors alignment
As they continue to successfully reduce these pressures, an interesting challenge appears to designers, namely to align multiple mated connector sets between two PCB boards.
What we need are clear guidelines to understand how to deal with these alignment challenges without sacrificing system performance, density and reliability, while meeting increasingly stringent budget and time-to-market requirements.
Before describing the conflicting requirements that may be encountered between advanced PCBs and more reliable high-density connectors, this article will discuss the alignment challenges in more detail so that these requirements can be efficiently met through the use of design best practices.
