In the process of Reverse Engineering Multilayer PCB Schematic for better ANTI-ESD Design, the anti-ESD design of the PCB can be realized by layering, proper layout, wiring and installation. In the design process, most of the design changes by reroute electronic circuit board gerber file can be limited to adding or removing components through prediction.
In the process of Reverse Engineering Multilayer PCB Schematic for better ANTI-ESD Design, the anti-ESD design of the PCB can be realized by layering, proper layout, wiring and installation.
By rerouting multilayer PCB layout design, you can prevent ESD well. The following are some common precautions.
Use multi-layer PCBs as the whole circuit board system design as much as possible. Compared with double-sided PCBs, the ground plane and power plane, as well as the closely spaced signal line-to-ground line spacing can reduce common mode impedance and inductive coupling, so that it can reach 1/ 2 of double-sided PCBs. 10 to 1/100. Try to place each signal layer close to a power layer or ground layer. For high-density PCBs with components on the top and bottom surfaces, very short connection lines, and many filled grounds, consider using inner-layer lines.
For double-sided PCBs, it is necessary to use closely interwoven power and ground grids. The power line is close to the ground line, and as much as possible between the vertical and horizontal lines or the filled area. The grid size on one side is less than or equal to 60mm. If possible, the grid size should be less than 13mm. Make sure that each circuit is as compact as possible
