Reverse Engineering Multi-layer Circuit Board CAD File Principle involve many aspects, including basic principles, anti-interference, electromagnetic compatibility, safety protection, and so on. For these aspects, especially in high-frequency circuits (especially in microwave-level high-frequency circuit board reverse engineering), the lack of relevant concepts often leads to the failure of the entire R&D project.
Many people still stay on the basis of “connecting electrical principles with conductors to play a predetermined role”, and even think that “PCB circuit board reverse engineering design belongs to the consideration of structure, process and improvement of production efficiency”. Many professional RF engineers have not fully realized that this link should be a special focus of the entire pcb board drawing design work in RF design, and mistakenly spent energy on selecting high-performance components. As a result, the cost has risen sharply, but the performance improvement has been minimal.
What should be particularly mentioned here is that digital circuits rely on their strong anti-interference, error detection and correction, and various intelligent links can be arbitrarily constructed to ensure the normal function of the circuit. A common digital application circuit with high additional configuration of various “ensure normal” links is obviously an initiative without a product concept.
But often in the link that “not worth”, it leads to a series of problems in the product. The reason is that this kind of functional link that is not worthy of constructing reliability guarantee from the perspective of product engineering should be built on the working mechanism of the digital circuit itself, but the wrong construction in circuit design (including PCB design), resulting in a circuit in a stable state. The cause of this unstable state is similar to the problem of high-frequency circuits and belongs to the basic application under the same concept.