Reverse Engineering Microwave level high frequency PCB Board design has become quite common in the PCB card cloning industry. The PCB layout design cloning principle for microwave-grade high-frequency circuits was chosen because it has broad guiding significance and is currently a popular high-tech application technology.
The transition from the microwave circuit PCB design concept to the high-speed wireless network (including various types of access networks) project is also the same, because they are based on the same basic principle and dual transmission line theory.
Experienced design engineers can reverse engineering digital circuits or relatively low frequency circuit PCB boards. The success rate is very high because their design philosophy is based on “distributed” parameters, and the concept of distributed parameters is in lower frequency circuits (including In digital circuits, the destructive effect is often overlooked by people.
For a long time, reverse engineering of electronic PCB card (mainly aimed at communication products) completed by many peers is often problematic. On the one hand, it is certainly related to the lack of necessary links in the design of electrical principles (including redundancy design, reliability design, etc.), but more importantly, many of these problems occur when people think that the necessary links have been considered.
In response to these problems, they often spend energy on checking procedures, electrical principles, parameter redundancy, etc., but rarely spend energy on reviewing PCB design, and often because of PCB design defects, resulting in a lot of Product performance issues.