In the process of Reverse Engineering Electronic Circuit Board Design, the anti-ESD design of the PCB circuit board can be realized by layering, proper electronic PCB card relayout, wiring and installation.
Reverse Engineering Electronic Circuit Board Design to extract printed circuit board layout drawing, cad file, gerber file and BOM, schematic diagram
By adjusting the PCB layout and wiring, you can prevent ESD well. Reroute multi-layer PCB layout design as much as possible. Compared with double-sided PCBs, the ground plane and power plane, and the closely arranged signal line-ground line spacing can reduce the common mode impedance. It is inductively coupled to 1/10 to 1/100 of the double-sided PCB. Both the top and bottom surfaces have components and have short connection lines.
Static electricity from the human body, the environment and even the inside of electronic devices can cause various damages to precision semiconductor chips, such as penetrating the thin insulating layer inside the components; damaging the gates of MOSFETs and CMOS components;
Flip-flops in CMOS devices are locked; short-circuited reverse-biased PN junctions; short-circuited forward-biased PN junctions; melted solder wires or aluminum wires inside active devices. In order to eliminate the interference and destruction of electrostatic discharge (ESD) on electronic equipment, a variety of technical measures need to be taken to prevent it.
