Designers also need to understand the requirements of device functions for Relayout Electronic PCB Card Circuitry Scheme and printed circuit board rewiring. For example, some devices generate heat due to high power consumption. Then, the problem of heat dissipation must be specially considered during layout.
When layout components on the BOM List of PCB board, one of the first factors to consider is electrical performance. Place components with close connections as much as possible. Especially for some high-speed lines, make them as short as possible when laying out. Power and small signals Devices should be separated.
First determine the position of the core device of the functional circuit and lock it with the LOCK function of the PCB reverse engineering ORCAD software so that it can’t be moved by mistake. Then take this core element as the center,
Layout around it, the best arrangement of the device when it is placed, there must be a certain distance between the devices, to avoid because the device arrangement is too dense, resulting in the most complicate situation where welding is not possible in the later welding stage.
If the printed circuit board is to be wave soldered, the device should be placed within 3 mm of the edge as much as possible or at least greater than the board thickness. The best shape of the circuit board is rectangular. The aspect ratio is 3: 2 or 4: 3.
When the circuit board surface size is greater than 200 * 150mm, the mechanical strength of the circuit board should be considered
