In the conceptual redesign Photodetector PCB Board Layout drawing and Schematic diagram stage, establish a three-dimensional finite element model of the Photodetector PCB Board, the modal parameters of the Photodetector PCB Board obtained under the condition of 4-point fixed support are studied.
redesign Photodetector PCB Board Layout drawing and Schematic diagram
The analysis shows that the difference between the frequency of the 1st and the second order and the frequency of the 4th and the 5th order is small, and the phenomenon of multi-order resonance is prone to occur between adjacent orders.
Under the test conditions of GJB150.16-86, the random vibration response of the Photodetector PCB Board was analyzed by the block Lanzos method, focusing on the warpage of the Photodetector PCB Board by the random vibration load, solder joint reliability, optical coupling efficiency and optical fiber ribbon Reliablility;
In addition to thermal shock, vibration shock is the most important factor affecting the reliability of electronic products. Vibration shock not only affects the reliability of electronic packaging, but also affects the optical coupling efficiency of optoelectronic interconnects. Many scholars at home and abroad have begun to pay attention to this issue and carry out some related research.
