Based on the characteristics of the Printed Circuit Board Supporting Structure, an analysis model for supporting layout topology optimization is established:
Printed Circuit Board Supporting Structure
using massless solid elements to simulate the supporting part; using the degree of freedom condensation technology to establish a sub-structure model of the PCB board and its components, thereby greatly reduce the amount of optimization calculations.
On the basis of the optimization pcb card reverse engineering analysis model, the incremental optimization method is used to derive the deletion sensitivity of the structural support elements and the calculation method based on ANSYS is established.
The influence of the support stiffness on the optimization of the support layout is analyzed. Finally, an optimization example is used to verify the correctness of the optimization method.
