Printed Circuit Board Reverse Engineering Recommendation
Product improvement is one of the main purpose for Printed Circuit Board Reverse Engineering
1st aspect is Inadequate data
The items, as documented during the printed circuit board reverse engineering process, may not have been previously considered for printed circuit board improvement because of inadequate data, these datas might include Layout drawing, Gerber file, schematic diagram or BOM;
2nd is referring to Engineering evaluation
Using the new data developed during the printed circuit board reverse engineering process, an engineering evaluation may be conducted and product improvements made. this evaluation include layout drawing modification, component substitutes replacement, schematic diagram improvement and production/assembly process improvement;
3rd is related to Product reliability
Remember, it may not be in the best interest of the current supplier(s) to improve the reliability of their printed circuit board, thus reducing the requirements. Examples of areas with product improvement potential are:
- Bearings operating beyond manufacturers recommendations,
- Electronic components operating at peak capacity,
- Use of inadequate materials and protective coatings,
- Use of older technology, and
- Use of non-standard components.