The electrical connection between the various devices on the FR4 copper-clad PCBA is realized through the copper foil traces and vias laid on each layer of PCB Design Reverse Engineering. Due to the different currents of different PCB Board and different modules, in order to realize each function, the designer needs to know whether the designed traces and vias can carry the corresponding current, so as to realize the function of the product and prevent the product from burning when over-current.
PCB Design Reverse Engineering
Reverse engineering circuit board design and test the current carrying capacity of the traces and vias on the FR4 copper-clad board and the test results. The test results can provide designers with a certain reference in future designs, so that the PCB design reverse engineering is more reasonable and more in line with current requirements.
At this stage, the main material of the printed circuit board (PCB) is FR4 copper-clad board. The copper foil with a copper purity of not less than 99.8% realizes the electrical connection between the various components on the plane, and the plated through holes (that is, VIA) realize the same The electrical connection in the space between the signal copper foils.
In order to reverse engineering the PCB layout design more reasonable and meet the requirements, the current carrying capacity of copper foil with different wire diameters was tested, and the test results were used as a reference for the design.
