Many PCB card cloning engineers typically consider the issue of anti-static discharge (ESD) when the PCB card enters production especially for the multilayer PCB board reverse engineering. If the electronic PCB card fails the anti-static release test, they will work overtime to find a solution that will not damage the original design. However, the final solution usually requires expensive electronic components, manual assembly during the manufacturing process, and even reverse engineering PCB, so the progress of the product is bound to be affected.
Even experienced engineers and design engineers may not know which parts of the design are good for ESD. Most electronic PCB card are in an ESD-filled environment 99% of their lifetime, and ESD can come from the human body, furniture, and even the device itself. It is rare for an electronic device to be completely damaged by ESD. However, ESD interference is common when reverse engineering printed circuit board, which can cause device lock-up, reset, data loss, and unreliability. The result may be: electronic equipment often malfunctions during cold and dry winters, but it is normal when repaired, which will affect the user’s confidence in electronic equipment and its manufacturers.
To prevent ESD, you must first know what ESD is and how ESD enters the electronic device. ESD can occur when one charged conductor approaches another conductor. First, a strong electric field is established between the two conductors, creating a breakdown caused by the electric field. When the voltage between the two conductors exceeds the breakdown voltage of the air and the insulating medium between them, an arc is generated. In the 0.7 ns to 10 ns period, the arc current can reach tens of amps, sometimes even more than 100 amps. The arc will remain until the two conductors are shorted or the current is low enough to sustain the arc.
