The PCB Board reverse engineering technical drawing package for candidate may include restricted or inadequate end-item documentation and drawings which must be developed through engineering analyses of existing hardware.
A competitive Technical drawing package should include all the documentation necessary to describe the PCB Board design configuration, manufacturing, quality assurance, testing, and packaging requirements.
PCB Board Reverse Engineering Technical Drawing Package
The purpose of the Data Collection phase is to secure all the unrestricted documentation available, to preclude unnecessary duplication and to facilitate the development of technical documentation through PCB Board reverse engineering. The following data is desirable:
- Next higher assembly, which provides information on input/output parameters, mating parts, end-use, etc;
- Specifications, such as Test Specifications; Acceptance Test Procedures, Purchase Descriptions, etc;
- Parts list/data list, which identifies all parts and indicates if they are standard National Stock Numbers (NSNs), Military Standard (MIL-STD) parts, etc. The Data List should indicate the applicable drawings and specifications necessary and provide valuable information on specifications that should be researched to remove restrictive requirements;
- Schematics, which provide basic information for the Physical Configuration Audit (PCA), verify the parts list, and save time in tracing circuitry (i.e., Printed Circuit Board (PCB) wiring);
- Master pattern drawings, which provide copies of the my-lars, saving both time and the cost of re-drafting; and
- Next lower assembly, which identifies interfaces, input/output parameters, mating parts, etc.
