PC Board Composition Components contains two important ITEMs: Core and PP (Prepreg, semi-solid sheet). Both surfaces of the Core are covered with copper foil, which is used as a conductive layer, and the two surface layers are filled with solid material, which is composed of reinforcing material glass fiber impregnated with solid resin.
PC Board Composition Components contains two important ITEMs: Core and PP (Prepreg, semi-solid sheet). Both surfaces of the Core are covered with copper foil, which is used as a conductive layer,
There is no copper foil on the surface of PrePreg. It is composed of semi-solid resin and glass fiber, which is softer than Core. It forms the so-called wetting layer, which is mainly used as filling in PCB to bond the core board. In factory production, the wetting layer generally cannot exceed 3 Prepregs (the thickness is about 20 mils).
There is no copper foil on the surface of PP. It is composed of semi-solid resin and glass fiber, which is softer than Core. It forms the so-called wetting layer, which is mainly used as filling in PCB to bond the core board
Due to the semi-solid nature of PP, the thickness of PP in each PCB produced will also vary. Therefore, the consistency of impedance control may also vary. Cooperate with Core and PP to realize the reverse engineering design and manufacture of mul-tilayer PCB board.
