Optoelectronic Interconnection Circuit Board Reliability Analysis mainly refers to strong vibration and shock which are quite common in the equipment on automobiles, ships and aircrafts during their startup and operation. This service environment can be described as broadband random vibration.
Optoelectronic Interconnection Circuit Board Reliability Analysis
When serving in a random vibration environment, the Optoelectronic Interconnection Circuit Board Reliability Analysis will be greatly affected.
On the one hand, the solder joints on the optoelectronic interconnection circuit board substrate may fail; on the other hand, the optoelectronic interconnection circuit board may also be misaligned. The stress of the solder joint caused by random vibration load interacts with the stress of the solder joint caused by thermal fatigue, which greatly accelerates the failure of the solder joint Process.
Liguore et al. once pointed out that “the goal of reliability analysis of electronic equipment is to establish a model to achieve a failure-free life under the conditions of comprehensive consideration of vibration and temperature cycles. If vibration factors are not considered, it will lead to erroneous results.
“To some extent, solder joint failure or optical coupling failure caused by vibration and impact will become the main reason for the failure of optoelectronic interconnection PCB.
