The interconnection of various modules in electronic equipment often requires the use of a printed circuit board socket with spring contacts and a printed circuit board with connecting contacts designed to match it. These contacts should have a high degree of wear resistance and very low contact resistance to illustrate the Necessity of Printed Circuit Board Electroplating, which requires a layer of rare metals to be plated on them. The most commonly used metal is gold.
In addition, other coated metals can be used on the printed lines, such as tin plating, plating, and sometimes copper plating in certain printed areas.
Another type of coating on the copper printed wire is organic, usually a solder mask, where a layer of epoxy resin film is covered by screen printing technology where soldering is not required.
This process of applying a layer of organic solder preservative does not require electronic exchange. When the circuit board is immersed in the electroless plating solution, a nitrogen-resistant compound can stand on the exposed metal surface without being absorbed by the substrate .