Multilayer HDI PCB Board is such a large and growing PCB application market that it is made up of at least four different HDI platforms:
La placa PCB de interconexión multicapa de alta densidad es un mercado de aplicaciones de PCB tan grande y en crecimiento que se compone de al menos cuatro plataformas HDI diferentes:
(1) Substrates and Interposers;
(2) Modules;
(3) Portables;
and (4) High performance. Later we will provide more detail about the HDI market.
Multilayer HDI PCB Board Application
Substrate and Interposer technology is used for flip-chip or wire-bondable substrates. Microvias offer the escape for very dense flip-chip area arrays. Dielectric is new-engineered films.
A typical example is seen in below Figure. in the subsequent we will discuss these substrates in more detail.[/vc_column_text][/vc_column][/vc_row]
Flip-chip substrate for a memory BGA
Modules are small substrates that may have their ICs wire bonded, flip-chipped, or TAB mounted or may use fine-pitch CSPs. The discrete components are typically very small, such as 0201s or 0101s, and may even be embedded. The design rules are usually coarser than the single IC substrate, since the module may be larger than a single IC package. A typical
example is seen in below Figure.
High-performance system module for the base-station for video encryption
