When Mending Heidelberg Electronic Backplane Card, testing and repairing are very important, there are many methods to choose from, usually not only based on a certain fault situation of specific electronic equipment, a proper inspection and rework should be executed normally requires cross-combination. sometimes one single way is not enough to discover the root cause of the functions;
Although there are various kinds of electronic circuit board inpection and rework methods, the generally used motor circuit board maintanence methods are basically the same. The following describes the basic test and repair methods of electronic equipment for readers to choose when conducting circuit board test and repair work, or to refer to when combining and selecting.
One method is similar comparison method: Refers to a method of comparing and contrasting the electronic PCB board to be inspected with similar types of electronic equipment that can work normally. Usually, the faults are found out by comparing the voltages, waveforms, ground resistances, component parameters, etc. of the entire machine or the relevant circuit card in question, from the differences in the comparison values. This is a very valuable method for overhauling electronic equipment, especially for digital equipment and microprocessor-based electronic PC board restoration, in some case, printed circuit board reverse engineering will be applied for schematic extraction.
Another method is waveform observation: This is a dynamic test method for electronic equipment. With the help of an oscilloscope, it observes the waveform of the faulty part or related parts of the electronic equipment; and analyzes the cause of the fault and takes maintenance measures based on the differences in waveform shapes, amplitude parameters, time parameters obtained from the test and the normal waveform parameters of the electronic equipment. The waveform observation method is a very important and quantitative circuit board recovery method.
Parameter test method: It is an electronic equipment failure inspection method that uses instruments and meters to test voltage, current, component values, and device parameters in electronic equipment circuitry. Generally, the resistance value can be measured without power on; the voltage and current values are measured on power; or the related parameters are measured by removing the components from heidelberger Electronic Backplane Card when reverse engineering it to prepare the BOM (bill of material).
