When the Infrared Jammer PCB Board size is too large, the printed wiring lines will be long, the impedance will increase, the anti-noise capability will decrease, and the cost will also increase; if the PCB size is too small, the heat dissipation will be poor, and the adjacent lines will be easily interfered. After determining the size of the Infrared Jammer Circuit Board, determine the location of special components. Copy the Layout of all components of the printed wiring board according to the functional unit of the circuit. Observe the following guidelines when locating special components:
a. Shorten the connection between high-frequency components on the infrared jammer PCB board as much as possible, and try to reduce their distribution parameters and mutual electromagnetic interference. Components that are susceptible to interference should not be too close to each other, and input, output components should be kept as far apart as possible.
How to Copy Infrared Jammer PCB Board
b. There may be a high potential difference between some components or wires when copy infrared jammer electronic circuit board layout diagram, and the distance between them should be increased to avoid accidental short circuit caused by discharge. Components with high voltage should be arranged as far as possible in places that are not easily accessible by hand during debugging.
c. Components weighing more than 15g should be fixed with brackets and then welded. Those components that are large, heavy and generate a lot of heat should not be installed on the infrared jammer printed circuit board, But should be installed on the chassis bottom plate of the whole machine, and the heat dissipation problem should be considered. Thermal elements should be kept away from heating elements.
