Mosfet component can shortens the circuitry delay on the board, which is the basic condition for cloning a high-speed transmission PCB board, and the shorter the length of the line, the better.
Reducing the wire delay time usually adopts two methods: wire material length. The delay time per unit length is proportional to the square root of the substrate material’s electric induction rate.
It is assumed that the substrate material’s electric induction rate is reduced by 50% and the delay time is only 0.7 times. In recent years, due to advances in process micro-technology, wire density has been continuously improved.
The potential concern of the relative wire detailing “conductor loss” is also gradually surfaced. The impedance of the wire pattern is inversely proportional to the cross-sectional area of the wire and increases in proportion to the length of the wire.
That is, if the ratio is reduced, the overall impedance of the wire is inversely proportional to the length. When LSI is compared with a wire, the internal impedance of the LSI is much larger than that of the wire.
Therefore, the influence of the conductor loss of the LSI occurs earlier than the wire. The main reason for the change of the internal conductor of the LSI from Aluminum to Copper is that the impedance of Copper is 60% of that of Aluminum. Therefore, it is desirable to reduce the loss of the conductor by the change of the material, and if the board is When the wire is regarded as an LC line, it is necessary to treat the LSI internal wire as an RC line when Cloning High Speed Transmission PCB Board.
The conductor loss of a typical circuit board is not significant. Similar to the MCM (Multi Chip Module) using a fine wire pattern, even if the wire length is very short, it is impossible to get rid of the nightmare of conductor loss.
