Cloning anti-esd Circuit Board Gerber File needs to pay attention to its layout design, which will use multi-layer PCB design as much as possible.
Compared with double-sided PCB board cloning, the ground plane and power plane, as well as the tightly arranged signal line-ground spacing can reduce common mode impedance and inductive coupling, making it 1/of the double-sided PCB. 10 to 1/100.
Cloning anti-esd Circuit Board Gerber File needs to pay attention to its layout design, which will use multi-layer PCB design as much as possible.
Try to put each signal layer close to a power layer or ground layer. For high-density interconnect PCB board reverse engineering with components on the top and bottom surfaces, short connection lines, and many filling grounds, you can consider using inner layer lines.
For double-sided PCBs, tightly interwoven power and ground grids are used. The power line is close to the ground line, and as many connections as possible between the vertical and horizontal lines or the filled area. The grid size on one side is less than or equal to 60mm. If possible, the grid size should be less than 13mm.
Make sure that each circuit is as compact as possible, put all the connectors aside as much as possible, and if possible, lead the power cord into the center of the card and away from areas that are directly affected by ESD.
