The most critical point that affects reliability (in terms of performance here) is heat. Clone electronic PCB board design and layout to improve its thermal management, overheating integrated circuits (ICs) can become problematic over time, and the automotive environment can become very unforgiving.
For example, overheating components in an engine bay, or driving through climates ranging from winter in Michigan to summer in Arizona. From the IC package, through the PCB, to the complete product in the operating environment, heat should be controlled. So we need to use the virtual prototyping feature all the time in all stages of design to make sure we have a thermally reliable product.
Clone electronic PCB board design and layout to improve its thermal management, overheating integrated circuits (ICs) can become problematic over time
First, IC suppliers typically analyze component packaging and provide thermal characterization models. Next we wanted to analyze the stand-alone PCB as the design of PCB board reverse engineering. PCB designers often require analysis of the layout of their working parts to determine if they have made a circuit board that is difficult to cool.
And this work is not just a rough consideration of the device heat dissipation and location distribution with the board. Due to the many heat dissipation paths (heat sink, copper inside the board, transfer, conduction and divergence…), The data passed from the PCB board design system cloning to the thermal analysis must be complete.
The setup and execution of the analysis software must also be fairly intuitive, as you want the PCB designer using the software not necessarily to be a thermal expert and not delay the design process.
