PCB Reverse Engineering Services

PCB Reverse Engineering technology is used to reversely analyze the printed circuit board, and to acquire the Layout Drawing, Gerber File, Bill of materials (BOM), Schematic diagram and designators drawing  are restored in the aspect ratio of 1:1, and then these technical documents and production files are used for PCB board remanufacturing, component soldering, flying probe testing, circuit board debugging, and complete replication of the original circuit board.

Mechanical Parts Dimensional Analysis in PC Board Reverse Engineering

In many cases, manufacturing methods, such as punched parts, injection molded, or investment cast parts, indicate Mechanical Parts Dimensional Analysis in PC Board Reverse Engineering. (1) Normally, items that are sheared or punched do not require a good surface finish on the sheared edge. However, in some cases, the manufacturer will intentionally punch a hole…

PCB Board Reverse Engineering Dimensional Analysis

PCB Board Reverse Engineering Dimensional Analysis objective refers to the electronic/mechanical components on the Printed circuit board, the dimensions define the size and shape of the part and locate all part features. Tolerances describe the dimensional limits to facilitate manufacturing while ensuring proper fit and function of parts or assemblies. A dimensional analysis should be…

Part Identification in PCB Reverse Engineering

Part Identification in PCB Reverse Engineering After disassembly each piece-part/component in PCB reverse engineering process should be researched to identify existing NSNs, commercially available hardware, MIL-STD parts, and non-standard parts. Economic analysis. An economic analysis should be performed on all sole-source and non-standard piece-parts/components to determine the cost-effectiveness of reverse engineering PCB’s piece-part/component. A limited…

Disassembly PCB Board Reverse Engineering Target

When Disassembly PCB Board Reverse Engineering Target, notes should be recorded for possible assembly procedures to be included in the Technical data package. As they are disassembled, a list of all piece-parts/components should be created, including quantities and special part markings which may indicate that the part is either commercially available or a military specifications…

Printed Circuit Board Reverse Engineering Test

Printed Circuit Board Reverse Engineering Test includes three phases from initial inspection, test plan objective to worse-case analysis:   First consideration is Initial inspection The test requirements to be determined include initial inspection and testing of the hardware provided for printed circuit board reversing engineering, and for inspection and acceptance of the prototype to be…

Reverse Engineering PCB Data Evaluation

The Reverse Engineering PCB Data Evaluation sub-phase should take below consideration into account: All required PCB manufacturing materials specified in the bill of materials, notes, military or process specifications, or elsewhere within the applicable data? (Any deletions or omissions should be specified.) Are all parts (electronic or mechnically) completely dimensioned or otherwise fully defined? (Any…

PCB Board Reverse Engineering Technical Drawing Package

The PCB Board reverse engineering technical drawing package for candidate may include restricted or inadequate end-item documentation and drawings which must be developed through engineering analyses of existing hardware. A competitive Technical drawing package should include all the documentation necessary to describe the PCB Board design configuration, manufacturing, quality assurance, testing, and packaging requirements.   The…

Reverse Engineering PCB Card Primary Objective

The Reverse Engineering PCB Card Primary Objectiveis the development of unrestricted technical data such as the layout drawing, gerber file, list of component and schematic diagram, adequate for competitive procurement, through engineering evaluations of existing PCB Card. The nominal PCB Card reverse engineering process is depicted in below Figure. Detailed procedures are described in Subsections…