PCB Reverse Engineering technology is used to reversely analyze the printed circuit board, and to acquire the Layout Drawing, Gerber File, Bill of materials (BOM), Schematic diagram and designators drawing are restored in the aspect ratio of 1:1, and then these technical documents and production files are used for PCB board remanufacturing, component soldering, flying probe testing, circuit board debugging, and complete replication of the original circuit board.
Reverse Engineering PCB Board Drawing Sketches and specifications. Reverse Engineering PCB Board Drawing Sketches and specifications objective Reverse Engineering PCB Board Drawing Sketches and specifications developed at this time may be used to draft the Level 3 drawings, control drawings, and other technical documents required for the preliminary technical data package. Technical data requirements…
In many cases, manufacturing methods, such as punched parts, injection molded, or investment cast parts, indicate Mechanical Parts Dimensional Analysis in PC Board Reverse Engineering. (1) Normally, items that are sheared or punched do not require a good surface finish on the sheared edge. However, in some cases, the manufacturer will intentionally punch a hole…
PCB Board Reverse Engineering Dimensional Analysis objective refers to the electronic/mechanical components on the Printed circuit board, the dimensions define the size and shape of the part and locate all part features. Tolerances describe the dimensional limits to facilitate manufacturing while ensuring proper fit and function of parts or assemblies. A dimensional analysis should be…
PCB Board reverse engineering management plan may be developed at the beginning of the process. This plan may not be complete, however, until all the PCB layout drawing, list of component and schematic diagram are reviewed. This management plan may include in-process reviews and possible economical cut-off points. A tasking plan should be developed upon…
Part Identification in PCB Reverse Engineering After disassembly each piece-part/component in PCB reverse engineering process should be researched to identify existing NSNs, commercially available hardware, MIL-STD parts, and non-standard parts. Economic analysis. An economic analysis should be performed on all sole-source and non-standard piece-parts/components to determine the cost-effectiveness of reverse engineering PCB’s piece-part/component. A limited…
When Disassembly PCB Board Reverse Engineering Target, notes should be recorded for possible assembly procedures to be included in the Technical data package. As they are disassembled, a list of all piece-parts/components should be created, including quantities and special part markings which may indicate that the part is either commercially available or a military specifications…
Post-PC Board shipment inspection To preclude the replication of defects, the PC Board Reverse Engineering Initial Inspection for possible damage in shipment. sometimes the PC board sent from customers may have the faulty or malfunction problem such as the burn out capacitor, incapable integrated circuit or mis-match oscillators, unshaped terminal block or pin header. we…
Printed Circuit Board Reverse Engineering Test includes three phases from initial inspection, test plan objective to worse-case analysis: First consideration is Initial inspection The test requirements to be determined include initial inspection and testing of the hardware provided for printed circuit board reversing engineering, and for inspection and acceptance of the prototype to be…
The Reverse Engineering PCB Data Evaluation sub-phase should take below consideration into account: All required PCB manufacturing materials specified in the bill of materials, notes, military or process specifications, or elsewhere within the applicable data? (Any deletions or omissions should be specified.) Are all parts (electronic or mechnically) completely dimensioned or otherwise fully defined? (Any…
The PCB Board reverse engineering technical drawing package for candidate may include restricted or inadequate end-item documentation and drawings which must be developed through engineering analyses of existing hardware. A competitive Technical drawing package should include all the documentation necessary to describe the PCB Board design configuration, manufacturing, quality assurance, testing, and packaging requirements. The…