PCB Reverse Engineering technology is used to reversely analyze the printed circuit board, and to acquire the Layout Drawing, Gerber File, Bill of materials (BOM), Schematic diagram and designators drawing are restored in the aspect ratio of 1:1, and then these technical documents and production files are used for PCB board remanufacturing, component soldering, flying probe testing, circuit board debugging, and complete replication of the original circuit board.
In the process of High Frequency PCB Circuit Card Reverse Engineering, the index is usually recorded in the engineer’s catalogue in the form of self-resonance frequency. If the frequency below self-resonance is used directly, the reactance will become positive, mainly because the reactance is the same as the impedance, if the frequency is more than…
When Reverse Engineering Analog Digital Hybrid Circuit Board, it must be noted that the digital circuit switching will generate a transition current. Since the transition current will flow into the ground of the reset circuit, in order to prevent the current from flowing into the ground of the analog circuit, the ground of the analog…
Reverse Engineering PCB Board Analog Circuitry requires attention. In addition, there are still design elements that cannot be described on the layout drawing and schematic diagram. The circuit characteristics are changed in the form of wires, floating capacity, etc. In order to ensure the reliability of the PCB Board, these designs must be The elements…
Due to the high speed of the IC and the LSI semiconductor itself, and in order to achieve the purpose of normal operation of the High Density Printed Circuit Board Design, the technical competition is becoming more and more fierce and it is also become more important for the Integration of Analog & Digital Technology.…
Generally, engineer must consider Clone Printed Circuit Board Conductor Lost Effect, since the substrate pattern cross-sectional area is 100 μm, the DC resistance is about 172 Ω/m, and the MCM pattern cross-sectional area using the miniaturized wire is about 30 μm, but the DC impedance is as high as 573 Ω/m, assuming that the impedance…
Mosfet component can shortens the circuitry delay on the board, which is the basic condition for cloning a high-speed transmission PCB board, and the shorter the length of the line, the better. Reducing the wire delay time usually adopts two methods: wire material length. The delay time per unit length is proportional to the square…
The biggest problem in Reverse Engineering High Speed Printed Circuit Board with operating frequencies exceeding 1 GHz is the loss of induced electricity. The general circuit only needs to consider the conductor loss, but the induced loss near 1 GHz is dominant. Such a result is quite unexpected for beginners. The main reason is that…
MOS shortens the circuitry delay of the board, which is the basic condition to Clone PCB Board Conductor Loss, and the shorter the length of the wires, the better. Reducing the wire delay time usually adopts two methods: wire material length and length. The delay time per unit length is proportional to the square root…
The biggest problem in reverse engineering high-speed circuit board with operating frequencies exceeding 1 GHz is the loss of induced electricity. The general circuit only needs to consider the conductor loss, but the induced loss near 1 GHz is dominant. Such a result is quite unexpected for beginners. The main reason is that the importance…
In terms of environment, the Pad Geometry Design in PCB Reverse Engineering may be different and it is based on the type of welding used to mount the electronic parts. When it becomes possible, the pad shape should be defined in a way that is transparent to the mounting process used. Whether the parts are…