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A dielectric layer is sandwiched between every two conductive layers of the Printed circuit board, either the signal layer or the planar layer. For PCBs, the main function of the dielectric layer is support the whole pcb circuit board structure, and the main electrical function is insulation among conductive layers. First of all, since the…
What is LVDS Technology, LVDS is a low-amplitude differential signaling technique that uses very low amplitude signals (approximately 350mV), as electronic board design techniques continue to advance, interconnects of higher rate signals are required. In the case that the digital parallel signal of the digital synchronous signal is to reach the limit, the advantages of…
Differential signals are so widely used because of their many advantages over single-ended signals.as follows: 1, The differential circuit is very useful when the signal amplitude is small. If the amplitude of the signal is small, or the signal-to-noise ratio is very high, applying a differential signal can effectively double the signal amplitude. Differential and…
IBIS (Input/output Buffer Information Specification) model was originally developed by Intel Corporation as a model for digital signal integrity analysis for PCB board and system level. Now managed by the IBIS Open Forum and becoming the official industry standard, the IBIS model uses U/I and U/T tables to describe the characteristics of digital integrated circuit…
Simulation Program with Integrated Circuit Emphasis model also know as SPICE, SPICE is a powerful general purpose analog circuit simulator. The SPICE model is now widely used in electronic circuit design and has two major versions: HSPICE and PSPICE. HSPICE is mainly used in integrated circuit design, while PSPICE is mainly used in PCB board…
Today’s high-speed system design field has made the traditional pcb design method incompetent. With the rapid development of EDA technology and the corresponding changes in design methods, More and more engineers are adopting electronic board design methods based on signal integrity analysis that are closely integrated with EDA tools. During the Electronic Board Design process,…
Printed Circuit Board Interconnection System refers to the entire electrical path from the transmitter to the receiver on the PCB board, including chip package, connector, transmission line, via, connector, etc. The signal integrity problems caused by the interconnection effect are: 1, The delay signal is transmitted at a limited speed on the printed circuit board…
Today’s digital systems are rapidly developing in the direction of large-scale, small-volume, high-speed, and the design of electronic systems has entered the design field of GHz and above. As the electrical and structural support of various electronic systems, printed circuit boards are also moving toward multi-stack, high density, and high operating frequencies. Therefore, how to…
In the development and production of printed circuit board, the earlier attention and solution to PCB Board Electromagnetic Compatibility issues, the more manpower and material resources can be saved. If the cost of solving the electromagnetic compatibility issue in the PCB Board development stage is 1, then after the printed circuit board is finalized, the…
As the density of electronic components on PCBs increases, the routing becomes narrower and the signal frequency becomes higher and higher, EMC and EMI problems are inevitably introduced. The level of electromagnetic compatibility of PCB Board has become an important indicator for measuring the quality of electronic products and systems. Because electromagnetic compatibility indicators do…