Ground Plane Design in Circuit Board Reverse Engineering

Ground Plane Design in Circuit Board Reverse Engineering Ground planes also allow the transmission of high speed digital or analog signals using transmission line techniques (microstrip or stripline) where controlled impedances are required, as a result of that, Ground Plane Design must be taken into consideration of Circuit Board Reverse Engineering. The use of “buss wire”…

Soldering Integrated Circuit Ground Pin in PCB Reverse Engineering

Soldering Integrated Circuit Ground Pin in PCB Reverse Engineering All soldering integrated circuit ground pin in PCB Reverse Engineering should be soldered directly to the low impedance ground plane to minimize series inductance and resistance. The use of traditional IC sockets is not recommended with high speed devices. The extra inductance and capacitance of even…

Reverse Engineering Mixed Signal PCB

Mixed Signal PCB Reverse Engineering To further complicate the issue, Reverse Engineering Mixed Signal PCB can find that mixed-signal ICs have both analog and digital ports, and because of this, much confusion has resulted with respect to proper grounding techniques. In addition, some mixed-signal ICs have relatively low digital currents, while others have high digital…

Signal Processing in Circuit Board Cloning

Signal Processing in Circuit Board Cloning Today’s signal processing in Circuit board cloning system generally require mixed-signal devices such as analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) as well as fast digital signal processors (DSPs). Requirements for processing analog signals having wide dynamic ranges increase the importance of high performance ADCs and DACs.    …