IBIS (Input/output Buffer Information Specification) model was originally developed by Intel Corporation as a model for digital signal integrity analysis for PCB board and system level. Now managed by the IBIS Open Forum and becoming the official industry standard, the IBIS model uses U/I and U/T tables to describe the characteristics of digital integrated circuit…
Simulation Program with Integrated Circuit Emphasis model also know as SPICE, SPICE is a powerful general purpose analog circuit simulator. The SPICE model is now widely used in electronic circuit design and has two major versions: HSPICE and PSPICE. HSPICE is mainly used in integrated circuit design, while PSPICE is mainly used in PCB board…
Today’s high-speed system design field has made the traditional pcb design method incompetent. With the rapid development of EDA technology and the corresponding changes in design methods, More and more engineers are adopting electronic board design methods based on signal integrity analysis that are closely integrated with EDA tools. During the Electronic Board Design process,…
The traditional Electronic Circuit Board Reverse Engineering method is a prototype production method. The reverse engineering flow consists of schematic diagram design, layout and gerber file design, pcb production, measurement and debugging, etc. The disadvantage of this method is that the entire design process is uncontrollable. In the Electronic Circuit Board schematic diagram and layout…
Printed Circuit Board Interconnection System refers to the entire electrical path from the transmitter to the receiver on the PCB board, including chip package, connector, transmission line, via, connector, etc. The signal integrity problems caused by the interconnection effect are: 1, The delay signal is transmitted at a limited speed on the printed circuit board…
Today’s digital systems are rapidly developing in the direction of large-scale, small-volume, high-speed, and the design of electronic systems has entered the design field of GHz and above. As the electrical and structural support of various electronic systems, printed circuit boards are also moving toward multi-stack, high density, and high operating frequencies. Therefore, how to…
The goal of Redesign PCB Board Layout For Better EMC Performance process is: “Each process has a verification, and the quality problem is controlled in the earliest stage in time”. Three design control points are added for this: (1) circuit simulation before wiring; (2) Signal integrity analysis, electromagnetic compatibility analysis, power integrity analysis, thermal radiation…
In the development and production of printed circuit board, the earlier attention and solution to PCB Board Electromagnetic Compatibility issues, the more manpower and material resources can be saved. If the cost of solving the electromagnetic compatibility issue in the PCB Board development stage is 1, then after the printed circuit board is finalized, the…
As the density of electronic components on PCBs increases, the routing becomes narrower and the signal frequency becomes higher and higher, EMC and EMI problems are inevitably introduced. The level of electromagnetic compatibility of PCB Board has become an important indicator for measuring the quality of electronic products and systems. Because electromagnetic compatibility indicators do…
With the increasing speed of modern circuit signal transmission, the current Circuit Board Design is no longer just a simple electronic connection device, but a complex and independent product with its own specific component requirements, which is the support for the system function. In the system design process, appropriate methods should be taken to ensure…