High Frequency Printed Circuit Board Design Cloning have become the mainstream, and every PCB engineer should be proficient in it. Today, let’s talk about some pcb board cloning experience of hardware experts in high-frequency and high-speed PCB circuits.
The basic idea of avoiding high-frequency electronic pcb board interference is to minimize the interference of high-frequency signal electromagnetic fields, which is the so-called crosstalk (Crosstalk).
You can increase the distance between the high-speed signal and the analog signal, or add ground guard/shunt traces next to the analog signal. Also pay attention to the noise interference of digital ground to analog ground When reverse engineering high-speed PCB circuits, impedance matching is one of the design elements.
The impedance value has an absolute relationship with the routing method, such as walking on the surface layer (microstrip) or inner layer (stripline/double stripline), the distance from the reference layer (power layer or ground layer), trace width, PCB material, etc. Both will affect the characteristic impedance value of the trace. That is to say, the impedance value can only be determined after wiring.
General simulation software will not be able to consider some wiring conditions with discontinuous impedance due to the limitation of the line model or the mathematical algorithm used. At this time, only some terminators (terminations), such as series resistors, can be reserved on the schematic diagram to Moderates the effects of trace impedance discontinuities for HDI PCB board. The real fundamental solution to the problem of High Frequency Printed Circuit Board Design Cloning is to try to avoid impedance discontinuity when wiring.