In many CAD systems, High Speed Printed Circuit Board Gerber File Cloning is determined by the network system. The mesh is too dense, although the path is increased, but the stepping is too small, the data volume of the field is too large, which inevitably has higher requirements on the storage space of the device, and the computing speed of the object computer electronic product is also Great impact. Some of the paths are invalid, such as occupied by the pads of the component legs or occupied by the mounting holes and the holes. The grid is too sparse, and too few paths have a great impact on the routing rate. Therefore, there must be a sparse and reasonable grid system to support the wiring after PCB Reverse Engineering.
The distance between the legs of the standard components is 0.1 inches (2.54mm), so the basis of the grid system is generally set to 0.1 inches (2.54 mm) or less than 0.1 inches of multiples, such as: 0.05 inches, 0.025 inches, 0.02 Inches and so on.
After the High Speed Printed Circuit Board Gerber File Cloning is completed, it is necessary to carefully check whether the wiring design meets the rules set by the designer, and also to confirm whether the established rules meet the requirements of the printed circuit board board production process. The general inspection has the following aspects:
(1), line and line, line and component pad, wire and through hole, component pad and through hole, whether the distance between the through hole and the through hole is reasonable, and whether the production requirements are met.
(2) Is the width of the power and ground lines appropriate, and is there a tight coupling between the power supply and the ground (low wave impedance)? Is there a place in the PCB that allows the ground line to be widened?
(3) Whether the best measures are taken for the key signal lines, such as the shortest length, the protection line, the input line and the output line are clearly separated.
(4) Whether the analog circuit and the digital circuit part have separate ground lines.
(5) Whether the graphics (such as icons and markers) added to the PCB will cause a signal short circuit in the process of REVERSE ENGINEERING PCB BOARD ANALOG CIRCUITRY.
(6) Modify some unsatisfactory lines.
(7) Is there a process line on the PCB? Whether the solder mask meets the requirements of the production process, whether the solder mask size is appropriate, and whether the character mark is pressed on the device pad, so as not to affect the quality of the electrical equipment.
(8) Whether the edge of the outer frame of the power supply ground layer in the multi-layer printed circuit board is reduced, for example, the copper foil of the power supply ground layer is likely to cause a short circuit outside the exposed plate.
