Reverse Engineering Circuit Board Documents Inputting Phase will follow below points: 1. Whether the information received in the pcb board cloning process is complete (including: schematic diagram, *.pcb file, bill of materials, PCB design description and PCB design or change requirements, standardization requirements description, process design description document) 2. Make sure the PCB template is…
Before Reverse Engineering Wireless Communication PCB Board, we must first determine the stacking structure of the multilayer circuit board, just like building a house, you must first have the walls of the house. The determination of the stack structure of the circuit board is related to many factors such as the complexity of the reverse…
Successful Telecommunication PCB Board Reverse Engineering requires careful attention to every step and detail throughout the reverse engineering process, which means thorough, careful planning at the beginning of the radio frequency module pc board wiring schematic reverse engineering and a comprehensive and ongoing assessment of the progress of each step . And this kind of…
Since the resolution capability of the traditional exposure machine is about 50μm, for the production of high level multilery printed circuit boards, a laser direct imaging machine (LDI) can be introduced to improve the image resolution capability, and the resolution capability can reach about 20μm. The multilayer PCB board alignment controlling accuracy of traditional exposure…
The main factors considered in the Cloning Multilayer PCB Board Laminated Structure are the heat resistance of the material, the withstand voltage, the amount of glue filling and the thickness of the dielectric layer, etc. The following main principles should be followed. (1) Prepreg and core board manufacturers must be consistent. In order to ensure…
Multilayer Printed Circuit Board Manufacturing main production difficulties compared with the characteristics of conventional circuit boards, high-level electronic multilayer circuit boards have the characteristics of thicker boards, more layers, denser lines and vias, larger unit size, and thinner dielectric layers. Impedance design control and reliability requirements are more stringent. 1.1 Difficulties in inter-layer alignment Due…
Electronic Multilayer PCB Boards are generally defined as high-level multi-layer circuit boards with 10 layers to 20 layers or more, which are more difficult to process than traditional multi-layer circuit boards, and have high quality and reliability requirements. They are mainly used in communication equipment, high-end servers, and medical electronics, aviation, industrial control, military and…
When the Infrared Jammer PCB Board size is too large, the printed wiring lines will be long, the impedance will increase, the anti-noise capability will decrease, and the cost will also increase; if the PCB size is too small, the heat dissipation will be poor, and the adjacent lines will be easily interfered. After determining…
Power integrity is an increasingly complex issue in electronic vehicle PCB board design. A few years ago, all integrated circuits including microprocessors operated at 5V, and you only needed a 5V power supply and ground plane to provide adequate and stable power to the components. Today, Integrated circuits can operate in multiple voltage modes, down…
The most critical point that affects reliability (in terms of performance here) is heat. Clone electronic PCB board design and layout to improve its thermal management, overheating integrated circuits (ICs) can become problematic over time, and the automotive environment can become very unforgiving. For example, overheating components in an engine bay, or driving through climates…