Under normal circumstances, Multilayer Printed Circuit Board Schematic Reverse Design is carried out according to circuit functions. When re-wiring on the PCB board’s outer layer, more circuitry wiring pattern is required on the soldering surface and less wiring on the component surface, which is more convenience to the maintenance and troubleshooting of the printed circuit…
Characteristic Impedance Design in PCB Board Cloning is unchanged, the distance between the signal line and the reference layer must be increased while increasing the line width. Therefore, the surface radio frequency line of cloning pcb circuit card needs to refer to the third layer in the inter-layer, and the radio frequency is routed on…
Multilayer PC Board Impedance Design has been determined by PCB stack structure and it can redesign through reverse engineering printed circuit board schematic diagram and layout drawing; Common signal impedance types include single-ended 50 ohms, differential 100 ohms, single-ended radio frequency 50 ohms, etc. The impedance parameters can be calculated through the software Si9000. One…