A dielectric layer is sandwiched between every two conductive layers of the Printed circuit board, either the signal layer or the planar layer. For PCBs, the main function of the dielectric layer is support the whole pcb circuit board structure, and the main electrical function is insulation among conductive layers. First of all, since the…
Electronic PCB Circuit Board Conductive Layer can be set either as a signal layer for wiring or as a planar layer for power or ground. In the process of desigining a PCB, the signal layers are called “positive films” and the planar layers are called “negative films”, which differ in design methods. The positive film…
Since the 1990s, more and more chips have been packaged in BGA (ball array) packages, and as technology continues to evolve, the Pitch (the center distance between solder balls and solder balls) of the package has become smaller and smaller. In this case, the solder balls located in the inner layer of the chip are…
Since the invention of the PCB by the Austrian engineer Paul Eisler in 1936 and its use in radio circuits, the PCB has been widely accepted and rapidly developed by the electronics industry. Originally, PCB Circuit Board Structure was single-sided, and later developed to double-sided, then four layers, and now it has grown to multiple…
The reconfigurable broadband software radio transceiver circuit board reverse engineering explores issues related to PCB board design. Firstly, this paper analyzes the structure and working principle of common RF receivers, and introduces a broadband RF and high-speed digital hybrid circuit board design. Then, the structure of the Radio Transceiver Circuit Board is studied from the…
With the rapid development of wireless communication technology, various new and old communication systems coexist. The idea of building a unified hardware platform and using software to switch between different communication systems has caused great concern which is also one of the most headache issues for High Speed Printed Circuit Board Reverse Engineering. However, one…
What is LVDS Technology, LVDS is a low-amplitude differential signaling technique that uses very low amplitude signals (approximately 350mV), as electronic board design techniques continue to advance, interconnects of higher rate signals are required. In the case that the digital parallel signal of the digital synchronous signal is to reach the limit, the advantages of…
Differential signals are so widely used because of their many advantages over single-ended signals.as follows: 1, The differential circuit is very useful when the signal amplitude is small. If the amplitude of the signal is small, or the signal-to-noise ratio is very high, applying a differential signal can effectively double the signal amplitude. Differential and…
With the continuous improvement of the working speed of electronic circuit boards and the requirements for higher data transmission rates, the traditional lumped circuit parameter model has also been replaced by distributed circuit parameter models, and circuit boards designers are increasingly shifting their attention. How to overcome various signal integrity problems that occur in high-speed…
IBIS (Input/output Buffer Information Specification) model was originally developed by Intel Corporation as a model for digital signal integrity analysis for PCB board and system level. Now managed by the IBIS Open Forum and becoming the official industry standard, the IBIS model uses U/I and U/T tables to describe the characteristics of digital integrated circuit…