Mixed Signal Grounding in Cooling System PCB Board Reverse Engineering

Most ADC, DAC, and other mixed-signal device data sheets discuss grounding relative to Cooling System PCB Board Reverse Engineering, usually the manufacturer’s own evaluation board. This has been a source of confusion when trying to apply these principles to multicard or multi-ADC/DAC systems. The recommendation is usually to split the PCB ground plane into an…

Ground Plane Design in Circuit Board Reverse Engineering

Ground Plane Design in Circuit Board Reverse Engineering Ground planes also allow the transmission of high speed digital or analog signals using transmission line techniques (microstrip or stripline) where controlled impedances are required, as a result of that, Ground Plane Design must be taken into consideration of Circuit Board Reverse Engineering. The use of “buss wire”…