ESD Suppresion in PCB Card Reverse Engineering

PCB Card Reverse Engineering will help to reduces unnecessary costs associated with troubleshooting and rework. In PCB Card Reverse Engineering, due to the use of transient voltage suppressor (TVS) diodes to suppress direct charge injection due to ESD discharge, it is more important in PCB Card Reverse Engineering to overcome the electromagnetic interference (EMI) electromagnetic…

Value Engineering of PCB Cloning

Value Engineering of PCB Cloning Value Engineering objective A value engineering (VE) review of PCB Cloning candidates may reveal cost drivers over and beyond the sole source restrictions. Some probable high cost drivers are: excessive material requirements such as the capacitor, resistor, inductor and integrated circuits, PCB layout drawing defects, over design, functional redundancy, tolerance…

Printed Circuit Board Reverse Engineering Recommendation

Printed Circuit Board Reverse Engineering Recommendation Product improvement is one of the main purpose for Printed Circuit Board Reverse Engineering 1st aspect is Inadequate data The items, as documented during the printed circuit board reverse engineering process, may not have been previously considered for printed circuit board improvement because of inadequate data, these datas might include Layout…

Finalize Technical Drawing Package from PCB Reverse Engineering

Finalize Technical Drawing Package from PCB Reverse Engineering Formulate/deliver Technical Drawing Package A finalized technical drawing package should be formulated and delivered to the agency requesting the reverse engineering PCB. Include changes After approval of the prototype, all data changes required as a result of the manufacturing phase should be included in the final technical…