Daily Archives: May 24, 2018

Multilayer HDI PCB Board Application

Multilayer HDI PCB Board is such a large and growing PCB application market that it is made up of at least four different HDI platforms: (1) Substrates and Interposers; (2) Modules; (3) Portables; and (4) High performance. Later we will provide more detail about the HDI market. Substrate and Interposer technology is used for flip-chip or…

Plated through hole—Printed Circuit Board Technology Advancement

The next major advance that made the printed circuit board technology indispensable and laid the foundation for what we see today, was the ability to put a conductive surface inside a hole in a non-conductive material. This revolution has allowed interconnected circuitry on two sides and through many layers, giving rise to the plated through-hole.…